| 摘要 |
PURPOSE:To form a resistor film having high close adhesive strength on a polyimide film, by strongly adsorbing a catalyst nucleus for electroless plating on a base material having a heat accumulation layer using the polyimide film and forming a heat generating resistor by electroplating. CONSTITUTION:A polyimide film 2 is deposited on a heat dissipating plate 1 comprising a metal or ceramic as a heat accumulation layer in a proper thickness with due regard to power necessary for printing, printing quality and a printing speed etc. to form a substrate 3. Next, in order to strongly adsorb palladium 4 on the surface of the film 2, said substrate 3 is immersed in an alkali solution with a pH-value of 8 or more containing a palladium ion. If this substrate 3 is immersed in dimethylamine borane to be subjected to reducing treatment, the palladium ion on the film 2 becomes metal palladium and a heat generating resistor layer 5 is formed using said palladium as a catalyst nucleus by an electroless plating method and, after a photoresist 6 is formed on said layer 5, said photoresist 6 is used as a mask to pattern the resistor layer 5 by etching and the resist 6 is subsequently removed. Succeedingly, a current supply layer 7 is formed on the parts other than heat generating parts of the patterns of the heat generating resistor layer and, thereafter, a protective film 8 comprising silicon carbide or tantalum pentaoxide is deposited on the heat generating part. |
