| 摘要 |
PURPOSE:To prevent defects in contact, by providing an insulating projection layer on a sheet-type base on which a contact providing region and a chip mounting region are formed continuously, such that the insulating projection layer surrounds bonding sections between a chip and lead lines, and injecting resin in the space surrounded by the insulating projection layer. CONSTITUTION:An IC chip receiving aperture 1b, external connection contacts 2 and conducting lead lines 4 extended between the external connection contacts 2 and the IC chip receiving aperture 1b are formed on a sheet-type base. External connection terminals of an IC chip received in the IC chip receiving aperture 1b are bonded to the lead lines 4. An insulating projection layer 5 is formed so as to project from the base along the periphery of the IC chip receiving aperture 1b and so as to surround the bonding sections between the IC chip 3 and the lead lines 4. Resin 6 is then injected to cover the IC chip surrounded by the projection layer 5 and the bonding sections between the IC chip 3 and the lead lines 4. |
