| 摘要 |
PURPOSE:To prevent the generation of voids when a semiconductor device is mounted onto a vessel metallic plate by using a hard solder agent by miniaturizing the stepped section of a recessed section in the back surface of a semiconductor element and smoothing the whole back surface. CONSTITUTION:A section to which a via-hole must be formed is etched when a surface pattern is prepared and a recessed section is shaped onto the surface, and a surface metal 1 is applied previously to the recessed section. After a surface pattern is completed, the section of the recessed section formed previously onto the surface is also etched from the back surface, a recessed section in an extent that it reaches a surface metallic layer is shaped, and a back metal 3 is applied, and brought electrically into contact with the surface metal. The back metal is plated thickly with Au 4, thus miniaturizing the stepped section of the recessed section on the back, then smoothing the whole back surface.
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