发明名称 RESIST APPLYING METHOD
摘要 PURPOSE:To improve the yield in the process of forming a resist film on a substrate, by applying the resist while an amount of evacuation is varied according to increase of resist powder with the lapse of time of spinning for spreading the resist over the surface of the substrate. CONSTITUTION:An evacuation regulating device 10 is provided in an intermediate position of a duct 7 and is controlled by a control unit 11. In the device 10, a partition plate is shifted by an eccentric cam 14 energized by and rotating around C a spring 13 so that the aperture of the duct 7 is regulated thereby. In the initial stage of starting the spinning application, the partition plate 12 is fully opened to increase the area of the aperture of the duct 7, and then the area of the aperture is madually decreased with the lapse of time of application of the resist. In this manner, the yield in the process of forming a resist film on the substrate 2 can be improved.
申请公布号 JPS62222637(A) 申请公布日期 1987.09.30
申请号 JP19870052026 申请日期 1987.03.09
申请人 TOSHIBA CORP 发明人 SHIBATA KEIICHI
分类号 B05D1/40;G03F7/16;H01L21/027;H01L21/30 主分类号 B05D1/40
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