| 摘要 |
PURPOSE:To plate a Ti material with Cu in two stages in a short time by combining a preliminary plating soln. having a specified composition with a finish plating soln. having a specified composition. CONSTITUTION:The composition of a preliminary plating soln. is composed of, by weight, 10-20% Cu ion source enough to provide necessary Cu ions, 25-50% nitric acid, 5-10% hydrofluoric acid, 3-15% hypophosphorous acid, 0-4% acetic acid and the balance water. The composition of a finish plating soln. is composed of, by weight, 3-15% Cu ion source enough to provide necessary Cu ions, 5-30% nitric acid, 10-25% hydrofluoric acid, 2-10% hypophosphorous acid, 2-15% hydrogen peroxide, 0-4% acetic acid and the balance water. A Ti material is successively immersed in the preliminary plating soln. and the finish plating soln. to plate the surface of the Ti material with Cu. |
