| 摘要 |
A hybrid integrated circuit device comprising in combination, a semiconductor integrated circuit element (1) and a film resistor pattern (7). The film resistor pattern is formed on the outer surface of a base (6) which is mounted on a multilayer ceramic package (2) which incorporates the element (1). In this assembled and operated hybrid device, function trimming of the film resistor pattern can be carried out by using a computer and testing is easier than is capable with prior art devices. |
