发明名称 INSPECTION FOR HYBRID INTEGRATED CIRCUIT DEVICE
摘要 PURPOSE:To enable to comparatively easily automate the inspecting process for hybrid integrated circuit devices and to lessen exchange frequency of a holding part by a method wherein a metal contact is given to the holding part opposing to the lead terminal of the device, while the metal contact is made to connect to the inspecting jig and the inspection is carried out at the same time when the holding part holds the lead terminal. CONSTITUTION:Hybrid integrated circuit devices 1, which are objects to be inspected, have been respectively positioned in a prescribed direction at a prescribed position in a storing tray 5 in a posture that the lead terminal parts 7 thereof are all being faced upwards, while a holding part 14 having a contact part, which holds the lead terminal 7, and at the same time, can perform the prescribed abutment to the lead terminal 7, and a freely detachable inspecting jig 3 being connected to the contact part have been attached to the arm part 13 of the handling robot. While being controlled, the arm part 13 of the handling robot is made to shift to the hybrid integrated circuit device 1, which has been previously positioned in the storing tray, and at the same time when the holding part 14 holds the lead terminal 7 of the hybrid integrated circuit device 1, the inspection is carried out by an external testing device, going through the inspecting jig 3 from the contact part in the holding part 14.
申请公布号 JPS6032336(A) 申请公布日期 1985.02.19
申请号 JP19830141680 申请日期 1983.08.02
申请人 NIPPON DENKI KK 发明人 ISHIBASHI TAKAO;NITSUTA HIDETO
分类号 G01R31/26;H01L21/66 主分类号 G01R31/26
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