| 摘要 |
PURPOSE:To uniformize the thickness distribution of the coating film of a solution on an article to be treated, by making it possible to position one arbitrary dripping nozzle among a plurality of ones at the center of the article to be treated through a centering mechanism. CONSTITUTION:In a process for coating a wafer with a photoresist, for example, when the pump P corresponding to the solution L2 among solutions L1-L3 is selected by a control part 4 and operated, the drive part 3c of a centering mechanism 3 is operated and the dripping nozzle N2 corresponding to the solution L2 is accurately positioned at the part directly above the center of an article 2 to be treated. As a result, because the solution L2 dripped from the dripping nozzle N2 is accurately dripped to the center of the article 2 to be treated, said solution L2 is uniformly dispersed and applied to the surface of the article 2 to be treated by the action of centrifugal force applied thereafter. |
