| 摘要 |
PURPOSE:To prevent the deterioration of IC functions due to the intrusion of moisture, by the introduction of a process for attaching a moisture shielding means to the side surface of a light transmitting plate. CONSTITUTION:A side surface 2a of a light transmitting body 2 is metallized. A frame 8, which has a window 8a and a flange 8b, as a moisture shielding plate and the light transmitting body 2 are bonded by a silver soldering method and the like, and a light transmitting body 9 having a frame is obtained. A silicon resin layer 3 is formed on the surface of a chip 4 having the erased surface. The light transmitting body 9 having the frame is arranged on the surface of the light emitting bonding agent 3. The light transmitting bonding agent 3 is hardened by heating, and the light transmitting body 9 having the frame is fixed. A chip 4, an island part 6, the light transmitting body 9 having the frame and the like are arranged in a cavity 12 formed by molding frames 10 and 11. An ordinary molding resin 1 is injected through a gate 13, and a molding-resin surrounded body is formed.
|
