| 摘要 |
PURPOSE:To prevent defects at corner parts especially in an LCC package, and furthermore in sealing with a hot cap sealer, to improve the yield rate of sealing and to improve the reliability of a semiconductor device, by increasing the amount of glass at the corner parts. CONSTITUTION:Sealing glass 2 is applied on the surface of a cap 1 to an appropriate width. In an LCC package, the amount of application of the sealing glass in thin and the width is narrow. A similar sealing-glass applied part 9 is provided at the inside of the sealing glass material 2, which is applied on the surface of the cap 1, at each corner part. It is desirable that the parts 9 are provided on all the corner parts at four places. Namely, it is desirable that the glass of t<2>pi/4 is applied by a large amount. At the inside of each corner part, the sealing glass 9 is further applied, or the sealing glass is applied 11 and 12 in a overlapped manner at each corner part. Or a heaved part 13 of the glass applied layer is provided. Thus the amount of the glass at each corner part can be increased, and poor sucking of the glass can be eliminated. |
