发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To prevent any noise from being made while enabling semiconductor devices to be operated at high speed by a method wherein a package composed of pellets formed of photoelectric conversion elements and transparent bodies sealing the pellets is provided. CONSTITUTION:Photosignals 11a transmitted from specified light emitting parts 7 on pellets 3 in a semiconductor device 1 once go straight ahead in the vertical direction of the pellets 3 to be refracted by 90 deg. i.e. in the horizontal direction by mirror bodies 9. Thus, the photosignals 11a going straight ahead in the horizontal direction pass along the sides of a package 2 to enter into cavities 4 of adjoining semiconductor devices 1. At this time, the photosignals 11a entered into the cavities 4 in the horizontal direction are refracted in the vertical direction by the mirror bodies 9 mounted on the specified inside positions of caps 8 to irradiate specified photodetectors 6 on the pellets 3. Through these procedures, the photosignals 11a can be transmitted and detected mutually between adjoining semiconductor devices 1 within a package 2.
申请公布号 JPS62221165(A) 申请公布日期 1987.09.29
申请号 JP19860064113 申请日期 1986.03.24
申请人 HITACHI VLSI ENG CORP;HITACHI LTD 发明人 SHOJI TAKASHI
分类号 H01L23/02;H01L31/0232;H01L31/16 主分类号 H01L23/02
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