| 摘要 |
PURPOSE:To obtain a lead frame which can be used for a standard type process only by changing the lead frame without making a new press mold even if any number of unnecessary leads exist. CONSTITUTION:A pair of parallel frames 1, 6, a tub 2 for mounting an integrated circuit chip, tub leads 3, 8 for supporting and connecting the tub 2 to the frames 1, 6, a lead 4 the one free end of which is near the tub 2, a lead 5 which has a free end near and outside of a resin mold region 10 for sealing the integrated circuit chip, etc. mounted on the tub 2, connecting piece 7 which connects the leads 4 and 5 respectively and supports them to the frames 1, 6 and a support piece 9 which supports the lead 5 to the frames 1, 6 by going round the other free end of the lead 4 are provided in a structure. In this structure, a resin burr is prevented by providing the lead 5 at the position where a lead should originally be located by leaving a gap of approx. 0-0.2mm outside of the mold region 10 and the support piece 9 enables simultaneous processing by connecting the lead 5 by preventing the lead 5 is left alone and cannot be held in the cutting work of the connecting piece. |
