| 摘要 |
PURPOSE:To facilitate continuous production and realize high density circuit patterns by a method wherein resin material is molded solidly along an electrical insulating tape to reinforce it and external continuity members which connect circuit patterns to external conducting media are provided. CONSTITUTION:Molding resin 14 is released from a die 9 after it is cured. With this process, a thin electrical insulating tape 2 with low rigidity is reinforced by the molding resin 14 with high rigidity and a semiconductor package 1 which has high rigidity as a whole and is easy to handle is formed. Moreover, the molding resin 14 flows into the through-holes 5 for resin flow of the electrical insulating tape 2 and, at the same time, reaches the front surface of the electrical insulating tape 2 to form floating stoppers 16 for the tape. Further, as external continuity pins 12 and a heat sink 13 are inserted into the molding resin 14 and solidly molded, the number of manufacturing processes is reduced, the manufacturing is easier and the cost is saved compared to the conventional constitution. |
