| 摘要 |
PURPOSE:To remove the etching irregularity of a wafer by a method wherein the wafer, which is attached to the wafer chuck provided eccentrically for a pivotally moving shaft, is rotated on its own axis. CONSTITUTION:When a driving shaft 3 is turned by operating a driving device 2, a journal part 5, provided at the position eccentrical to the shaft center 4 of the driving shaft 3, performs a revolution with the shaft center 4 as the center. At the same time a wafer chuck 6 is also turned by a rotation device 7. As a result, the wafer chuck 6 performs a revolution and a rotation, and the wafer 10 attached to the wafer chuck 6 also performs a revolution and a rotation. Under the above-mentioned condition, an etchant 11 is jetted out from the lower part of the wafer 10 from a jetting device 8 in the form of a jet stream, so an etching of low degree of irregularity can be performed.
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