PHOTOELECTRON DEVICE

摘要

PURPOSE:To obtain the proper state of bonding, inhibiting the lowering of productivity by making a wire bonding surface on the lead side run parallel with a wire bonding surface for a light-receiving element. CONSTITUTION:A lead 11 electrically connected to a light-receiving element 7 by a wire 14 is constituted so that a wire bonding surface for the lead 11 is made to run parallel with a wire bonding surface for the light-receiving element 7. The light-receiving element 7 receiving laser beams 6 emitted from the lower end of a laser chip 5 and monitoring an optical output from laser beams 6 is fixed to a surface such as the main surface of a stem 1. The light- receiving element 7 is fastened to an inclined plane 8 having an angle such as 7 deg. to the main surface of the stem 1 in order to prevent projection into a window 16 for a cap 2 of reflected beams on the light-receiving surface of the light-receiving element 7. A conical section 15 is molded in a monolithic manner to an umbrella shape at the nose section of the lead 11 electrically connected to the light-receiving element 7, and the apex angle of the conical section 15 is set so that the inclined plane of the conical section 15 is made to run parallel with the inclination of the light-receiving element 7.