| 摘要 |
PURPOSE:To independently set the press bonding of a lead wire and the load of cutting as well as to enhance the reproducibility of cutting place without destructing a semiconductor element by a method wherein the press bonding part of the lead wire and the cutting part of the lead wire are independently provided on the wedge part of an ultrasonic wave bonding device. CONSTITUTION:The lead wire 11, with which a semiconductor element 9 and a semiconductor device container 10 will be connected, passes a clamp 12 and connected to the wedge 14 to be exclusively used for press bonding of the wedge 13, which is exclusively used for cutting of the lead wire, and the lead wire. The lead wire 11 is press- bonded on the bonding pad part 15 of the semiconductor element 9 by the wedge 14 to be used for press bonding only. Then, the clamp 12 is opened, the wedge 13 of cutting only and the wedge 14 of press bonding only are shifted to the semiconductor device container 10, and the lead wire 11 is press-bonded on the bonding pad part 16 of the semiconductor device container 10 with the wedge 14 to be exclusively used for press bonding. Then, the wedge 13 is fixed to the end part of the press-bonded part of the lead wire, the clamp 12 is closed and the wedge 14, to be exclusively used for press bonding, and the lead wire 11 are shifted upward, and the lead wire 11 is cut with the cutting only wedge 13. |
