| 摘要 |
PURPOSE:To enhance adhesive property between an organic sealing agent and a glass substrate, by providing a thin film comprising a thermosetting resin including a large amount of additive, which aids the bonding of the organic sealing agent and the glass substrate, between the organic sealing agent and the glass substrate. CONSTITUTION:A semiconductor substrate 14 is contained in a recess part of a case 15. A glass substrate 11 is sealed at the opening part of the case 15 through an organic sealing agent 13 comprising a ring shaped thermosetting resin. At this time, a thin film 12 comprising a thermosetting resin including a large amount of additive, which aids the bonding of the sealing agent 13 and the substrate 11, is provided between the substrate 11 and the sealing agent 13. Thus, the adhesive property between the sealing agent 13 and the substrate 11 is enhanced. |
