| 摘要 |
<p>PURPOSE:To restrain evaporation of Ba by putting a cathode base between a metal cover made of high melting point metal serving to cover the area except electron emitting surface and a metal support plate, and welding or brazing together the cover and the support plate. CONSTITUTION:A paste-like solder material wherein butylcarbinol acetate is added as a binder to Mo-41.6Ru euthetic fine powder is applied to the joint between a metal cover 6 and a metal support plate 5. Then, a cathode base 1 is inserted in the cover 6, and the support plate 5 is thereafter combined. Further, the base 1, the cover 6, the support plate 5 and a sleeve 3 are consolidated after the paste-like solder material is applied to the upper inner peripheral face of the sleeve 3 and heated in a predetermined time at a predetermined temperature under vacuum condition. Thus, Ra evaporation from the area other than electron emitting surface can be reduced.</p> |
