| 摘要 |
PURPOSE:To shorten the wire interconnecting length in a chip carrier to a large extent, by forming conductor columns on connecting terminals so as to penetrate an insulating protection film. CONSTITUTION:On one surface of an LSI chip 2, integrated electronic circuits and connecting terminals are formed. The surface for forming the electronic circuits and the connecting terminals is covered with an insulating protection film 4. At this time, conductor columns 3 are formed on the connecting terminals so as to penetrate the protection film 4. A chip carrier 1 is bonded on a substrate 5 in a face down posture as in a flip-chip mounting by using the conductor columns 3. Thus, the wiring interconnection length in the chip carrier 1 can be shortened to a large extent. |
