摘要 |
PURPOSE:To obtain the titled nonpeeling material excellent in adhesion by a simple process, by applying an epoxy resin to the surface of an aramid material and heat-treating the applied epoxy resin before, during or after the application. CONSTITUTION:0.01-10g of an epoxy resin such a a bisphenol A-derived or nitrogen-containing polyepoxy resin (e.g., triglycidyl-p-aminophenol) is applied to the surface of a polyamide material (1g) in the form of, e.g., a short or long fiber, tow, woven fabric or sheet, comprising fully aromatic polyamide compound of formula I and/or formula II (wherein Ar1-Ar3 are each a bivalent aromatic ring group) and is heat-treated at 50-400 deg.C for 0.1-30min in air or an inert gas atmosphere such as N2 or Ar before, during or after the application to obtain the titled material.
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