发明名称 WIRE BONDING METHOD
摘要 PURPOSE:To prevent the decrease in mechanical strength at a neck part on the side of first wire bonding, when the wire is bonded to first and second parts to be bonded, by performing the second bonding under the state wherein a vibration suppressing means is made to act on said parts. CONSTITUTION:First bonding and second bonding are sequentially performed by utilizing ultrasonic wave vibrating energy. A piece of wire 6 is bonded to a first part to be bonded 3 and a second part to be bonded 4. At this time, a resonance suppressing means 10 is made to act on the wire 6, which is extended from the part that is bonded to the first part to be bonded 3 to the second part to be bonded 4. Under this state, the second bonding is performed. Then, the wire bonding is carried out under the state mechanical strength at a part of neck 9 is maintained.
申请公布号 JPS62217623(A) 申请公布日期 1987.09.25
申请号 JP19860061273 申请日期 1986.03.19
申请人 FUJITSU LTD 发明人 WATANABE HISASHI;SUZUKI HIROSHI
分类号 H01L21/607;H01L21/60 主分类号 H01L21/607
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