| 摘要 |
<p>An acceleration pick-up (11) in which the bending plate is a substrate plate tensioned on one side, made for example of Al2O3. In this way, the resistors (18) and evaluation circuit (20) can be arranged jointly on the flexible spring (12) and can be applied in a single operation using the thick film technique. The expenditure for packing is minimal. The design of the acceleration sensor allows easy assembly and is attractive as regards cost.</p> |
