发明名称 PREPARATION OF ALUMINUM-CORED COPPER-CLAD LAMINATED PLATE
摘要 <p>PURPOSE:To obtain excellent adhesiveness of an insulative resin layer with a copper foil and an aluminum core by etching and roughing the aluminum surface with an acidic aqueous solution containing chlorine ions, by coating thinly the surface with a coupling agent and by heating and pressing a lamination of a specified insulative resin layer and the copper foil with each other. CONSTITUTION:An aluminum 3 the surface of which has been etched and roughed with an acidic aqueous solution containing chlorine ions are thereafter is being coated thinly with a coupling agent, an insulative resin layer 2 consisting of polyethylene, cross-linked polyethylene or polymethylpentene and a copper foil whose roughed surface is being coated with a coupling agent are put one upon another and heated and pressed. The resin 2 has poor adhesiveness, but by using this method, very strong adhesion between the aluminum plate 3 and the copper foil 1 can be obtained because of a physical anchor effect and a chemical adhesive effect.</p>
申请公布号 JPS62216727(A) 申请公布日期 1987.09.24
申请号 JP19860061575 申请日期 1986.03.19
申请人 HITACHI CHEM CO LTD 发明人 KAMIYA MASAMI;YOKOTA MITSUO;IIJIMA TOSHIYUKI
分类号 C08J5/12;B29C65/02;B29L9/00;B32B15/08;H05K3/38;H05K3/44 主分类号 C08J5/12
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