Carrier for high frequency integrated circuits

摘要

A carrier for high frequency integrated circuits replaces the usual very expensive machined metal carrier by ceramic material (1) which is light and inexpensive to produce. Through holes (4) in the ceramic material (1) form vias which are metal filled and connect with a metal surface (5, 6) on each side of the carrier, one surface (5) being gold. A strip line circuit and a GaAs or like device can be attached by solder or epoxy to the gold surface in which a heat sink can be incorporated if required. The metallising of the ceramic material can be carried out by thick film printing and firing or by metal deposition and plating.