Process for making metallized holes in a substrate having conductive and resistive paths and the product obtained by said process.

摘要

The process calls for drilling a flat substrate (1) having conductive and resistive paths (2) and then repeated washing thereof. After drying, a substance capable of promoting adhesion is deposited. A thin layer of copper is then deposited on the entire surface of the substrate and after masking galvanic growth of copper (6) in the holes (3) and in the immediately adjacent areas is performed. The chemically deposited copper is finally removed from the areas previously masked.