发明名称 PACKAGE STRUCTURE OF ELECTRONIC COMPONENT PART
摘要 PURPOSE:To increase external terminals without reducing the effective overall contact area of parts even when the pitches of electrodes are decreased by separately forming the external terminal for electrically connecting electronic parts to a wiring substrate and the external terminal for fixing and supporting the electronic parts. CONSTITUTION:A chip 1 is fastened at a central section, and a large number of lead terminals 2 electrically connected to the chip 1 are settled on a peripheral side surface at regular pitches so that the nose sections 7 of the lead terminals 2 are positioned on the side inner than an extrapolation line 6 formed by baseplates 9 for external terminals 4. The external terminals 4 each take a T shape, are shaped by terminals 4. The external terminals 4 each take a T shape, are shaped by arms 8, upper end sections thereof are fixed to the notch surfaces 5 of the peripheral side-surface corners of an electronic part 3, and the discoid baseplates 9 fastened to the lower end sections of the arms 8, and settle and support the electronic part 3 to a wiring substrate. Accordingly, since the electronic part is supported and fixed mechanically by one external terminal 4, the pitches of other external terminals 4 electrically connecting the electronic part 3 and the wiring substrate are decreased largely, thus easily increasing terminals of the electronic component part 3.
申请公布号 JPS62216256(A) 申请公布日期 1987.09.22
申请号 JP19860057037 申请日期 1986.03.17
申请人 HITACHI LTD 发明人 AKIBA YUTAKA;SERIZAWA KOJI
分类号 H01L23/50;H01L23/498;H05K3/30;H05K3/34 主分类号 H01L23/50
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