| 摘要 |
PURPOSE:To actually detect the quality of assembling condition by allowing a hitting contact member capable of making free vertical motion to make hitting contact with the lower part of a shadow mask frame, and detecting a movement of the hitting contact member caused by downward energization given to the frame in response to the motion of the hitting contact member. CONSTITUTION:In an assembling condition detecting device for panel P and mask M, e.g., four support blocks 14 are provided on the upper side of a main body, and an engagement detection mechanism 15 which detects the condition of engagement between a pin pp and the hole hh of a holder H, is provided between the blocks 14. A detector bar 16 serving as the hitting contact member is provided in hitting contact with the lower side ff of the frame F of the mask M in vertically free mode of motion. An energizing member 29 which energized the frame F downward in response to the motion of detector bar 16 is provided, and movement of the detector bar 16 by energization of the member 29 is detected by a rotary encoder 20 through a rack part 18 and a pinion 19. When detected amount of the movement of the frame F is smaller than a set up value, it is judged as the normal assembling condition. Thus, the quality of the assembling condition for the panel P and the mask M can be detected accurately.
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