| 摘要 |
PURPOSE:To prevent the adhesion of plating to wiring patterns in a semiconductor element housing hole completely by forming through-holes and the wiring patterns to a plurality of laminated board bodies through a specific process and plating the through-holes. CONSTITUTION:With a plurality of laminated board bodies 2, 5, 8, 10A, openings for shaping a semiconductor-element housing hole 16 are not formed to the board bodies 2, 10A on both outsides, wiring patterns except the outer surfaces of the board bodies 2, 10A on both outsides are laminated so as to be hermetically sealed by the board bodies 2, 10A on both outsides, through-holes 17 are shaped to a plurality of the board bodies 2, 5, 8, 10A while the through-holes 17 are plated, and an opening for forming the semiconductor-element housing hole 16 is shaped so at least one 10A of the board bodies on both outsides. Accordingly, the opening 11A for the board body 10 A positioned at the end of the semiconductor-element housing hole 16 is shaped lastly, thus positively preventing the state of on adhesion on the wiring patterns for copper foils 3, 7 for the board bodies 2, 5 of plating when the through-holes 17 are plated. |
