| 摘要 |
PURPOSE:To form a through-hole having a minute diameter, and to increase density and miniaturize a hybrid integrated circuit by executing specific processes to a ceramic substrate in succession and connecting an external lead terminal to an electrode for external connection. CONSTITUTION:A through-hole 3 is bored through laser drilling, etc. in a through-hole 2 in a ceramic substrate 1, and a conductor layer 4 is applied and formed through electroless plating and electrolytic plating. A circuit element 5 consisting of a thick film in which a desired conductor layer is connected to the through-hole 2 is shaped to one surface of the substrate 1, and a circuit element 6 composed of a thin-film in which a desired conductor layer is connected to the through-hole 2 is formed to the other surface of the substrate 1. Circuit elements 7, 8 such as are chips are loaded on the substrate 1, and an external lead terminal 10 is connected to an electrode 9 for external connection for the substrate 1. Accordingly, the through-hole having a minute diameter can be shaped, and the advantage of a thick-film method and the advantage of a thin-film method are combined, thus increasing density. |
