发明名称 CURABLE RESIN
摘要 PURPOSE:The titled resin of novel structure which is suitable as coating compound, etc., readily synthesized and has improved heat resistance and mechanical strength, obtained by combining a specific epoxy resin-phenol adduct with an unsaturated monohydroxyl compound and a vinyl ester resin. CONSTITUTION:(A) An epoxy resin-phenol adduct containing two or more hydroxyl groups and two or more allyloxymethylene groups in one molecule is combined with (B) an unsaturated monohydroxyl compound containing two or more (meth)acryloyl groups and two or more hydroxyl groups in one molecule and (C) a vinyl ester resin containing two or more (meth)acryloyl groups and two or more hydroxyl groups in one molecule through (D) a diisocyanate to give the aimed resin having a structure shown by the formula. The component A is obtained by reacting an epoxy resin with a monohydric phenol, the component B by reacting a monoepoxy compound with (meth)acrylic acid and the component C by reacting the epoxy resin with (meth)acrylic acid.
申请公布号 JPS62215622(A) 申请公布日期 1987.09.22
申请号 JP19860056065 申请日期 1986.03.15
申请人 SHOWA HIGHPOLYMER CO LTD 发明人 TAKIYAMA EIICHIRO;ARAI MICHIAKI;ARAI TAKAO
分类号 C08G59/40;C08F290/00;C08F299/06;C08G18/58;C09D175/00 主分类号 C08G59/40
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