| 摘要 |
PURPOSE:To mount the titled element with a high density by laminating a light receiving element array for receiving an optical signal transmitted in parallel onto a semiconductor substrate on which an electronic circuit for processing a signal has been formed, and a light emitting element for sending out said signal in the same direction, and welding them integrally in one body. CONSTITUTION:A light receiving element array 11 is constituted of a photodiode 13 which has been formed by a selective embedding growth method in a recessed part of a semi-insulating substrate 12, and a light emitting element array 14 is constituted of a light emitting diode 15 which has been formed on a semi- insulating substrate in the same way. The arrays 11, 14 are placed on an Si substrate 16 on which a signal processing electronic circuit 17 has been formed, and welded integrally in one body. An optical signal which is transmitted in parallel in the direction as indicated with an arrow is received by the array 11, and sent out in the same direction as indicated with an arrow by the array 14. In this way, a parallel optical signal processing semiconductor element can be mounted with a high density. |
