发明名称 |
Thick film conductor composition |
摘要 |
A thick film conductor composition for a ceramic wiring substrate comprises an inorganic ingredient mainly composed of a copper oxide powder added with a metal capable of forming a homogeneous solid solution with copper, and an organic vehicle. The inorganic ingredient may be further added with a manganese oxide or a heat resistant insulating material such as ceramics and/or glass.
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申请公布号 |
US4695403(A) |
申请公布日期 |
1987.09.22 |
申请号 |
US19860875083 |
申请日期 |
1986.06.17 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
NISHIMURA, TSUTOMU;NAKATANI, SEIICHI;YUHAKU, SATORU;ISHIDA, TORU |
分类号 |
C04B41/51;C04B41/88;H01B1/16;H01L23/498;H05K1/09;(IPC1-7):H01B1/00 |
主分类号 |
C04B41/51 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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