发明名称 Thick film conductor composition
摘要 A thick film conductor composition for a ceramic wiring substrate comprises an inorganic ingredient mainly composed of a copper oxide powder added with a metal capable of forming a homogeneous solid solution with copper, and an organic vehicle. The inorganic ingredient may be further added with a manganese oxide or a heat resistant insulating material such as ceramics and/or glass.
申请公布号 US4695403(A) 申请公布日期 1987.09.22
申请号 US19860875083 申请日期 1986.06.17
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 NISHIMURA, TSUTOMU;NAKATANI, SEIICHI;YUHAKU, SATORU;ISHIDA, TORU
分类号 C04B41/51;C04B41/88;H01B1/16;H01L23/498;H05K1/09;(IPC1-7):H01B1/00 主分类号 C04B41/51
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