| 摘要 |
PURPOSE:To compose a bonding pad structure avoiding a passivation crack on the peripheral part of a pad due to contact with a probe end by a method wherein the peripheral part of outer connecting terminal is covered with a surface protective inorganic insulating film while at least the peripheral part of terminal of the inorganic insulating film is covered with an organic insulating film. CONSTITUTION:A passivation film 7 is composed of, e.g., P.S.G. while an organic insulating film 8 is composed of e.g., polyimide base resin. After coating overall surface thickly with this polyimide resin 8, a bonding pad part is exposed by etching process using a photoresist mask. At this time, the width d of overlapped part shall be at least around 5-10mum to cover the peripheral part of pad sufficiently. The end 9 of a probe covered with highly flexible organic resin, even if imposing a horizontal stress on the peripheral part of pad, does not impose a direct stress on the passivation film 7 avoiding any crack or shortcircuit of Al line due to the crack.
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