| 摘要 |
<p>PURPOSE:To efficiently cool a low heat resistor by reducing three factors of thermal conductive path factors for forming an integrated circuit to coolant to the integrated circuit, fine gap, thermal conductive rod, water-cooling jacket and the coolant. CONSTITUTION:A fine gap is set on an integrated circuit 2, a thermal conductive rod 4 is secured, and the extended portion of the rod 4 in which female threads 6 are opened perpendicularly to a substrate 1 and a cutout parallel to the direction of the threads 6 through the axial center of the threads 6 is engaged with the through hole 7 of a water-cooling jacket 11 of a cooling plate. Male threads 8 are fitted to the threads 6 of the rod 4 and clamped. thus, the radial component 9 of the axial force expands the cutout of the rod 4, and closely secured by friction to the inner surface of the through hole of the jacket 11. Accordingly, a cooling structure that heat generated from the circuit 2 is cooled with less factors by one of thermal resistance elements than the prior art like fine gap 3, rod 4, jacket 11 and coolant 12 can be formed.</p> |
