| 摘要 |
<p>PURPOSE:To improve a semiconductor device in low-stress feature and in resistance to heat and moisture by a method wherein a semiconductor device is sealed in a special epoxy resin compound containing a product of reaction between a butadiene-acrylonitrile polymer equipped with carboxyl groups at both ends of its molecular chain and a silicone compound containing an amino group. CONSTITUTION:An epoxy resin compound to seal off a semiconductor element consists of an epoxy resin (component A), a novolak-type phenolic resin (component B), and a product (component C) of reaction between a butadiene- acrylonitrile polymer equipped with carboxyl groups at both ends of its molecular chain and silicone compound containing an amino group. The epoxy resin compound is supplied in powder or in tablets. As for the compounding ratio of the component A that is an epoxy resin to that of the component B that is a novolak-type phenolic resin n such an epoxy resin compound, the ratio of the epoxy group in the epoxy resin to that of the hydroxyl group in the phenolic resin should preferably fall in the range 0.6-1.4 in equivalent weight and, for a better result, in the range 0.8-1.2. The result is better when the equivalent ratio is nearer to 1.</p> |
