| 摘要 |
PURPOSE:To make a resin soak into holes formed in the surface of an Al oxide film and to prevent the peeling of a resin layer, which has been generated by the conventional way, even though gas is generated from the resin layer by providing the Al oxide film on a metal substrate of a three-layer structure of a copper plate, an invar and a copper plate through an Al-plated layer. CONSTITUTION:An Al oxide film 5 is provided on a metal substrate 1 of a three-layer structure of a copper plate 2, and invar 3 and a copper plate 2 through an Al-plated layer 4. Thereby, as the surface of the Al oxide film 5 is porous, an insulating resin layer 6 soaks into holes formed in the surface of the Al oxide film, the adhesion is improved and even though the substrate 1 is heated at about 320 deg.C, the peeling of the resin layer 6 is not generated unlike the conventional way.
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