| 摘要 |
PURPOSE:To enable a coating film to be formed in even thickness on overall surface with high precision by method wherein a nozzle temperature controller to control the temperature at the nozzle end is provided. CONSTITUTION:Before coating photoresist 12, the temperature of a spin head 2 is controlled by a spin head temperature controller 5 to heat a wafer mounted on the spin head 2 up to the specified temperature at A. On the other hand, the temperature of a temperature control part 9 is controlled by a nozzle temperature controller 8 at specified temperature of A. Next, a few cc of photoresist 12 is dripped on a wafer 1 and simultaneously a spin motor 4 is driven to turn the wafer 1 mounted on the spin head 2. By this turning operation, the photoresist 12 dripped on the central main surface of wafer 1 is evenly spread on overall main surface of wafer 1 by the centrifugal force as well as the tuning of wafer 1 itself.
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