| 摘要 |
PURPOSE:To enable manufacture at low cost without sacrificing printing quality and recording speed by forming a thermal resistor on an enameled substrate using thin film technology and also forming a conductor for lead electrode with thick film technology. CONSTITUTION:A thin film 2 of thermal resistor composed of a mixture of TiB2-SiC is formed and patternized on an enameled substrate 1 using a low- alkali crystalline glass such as Mg2B2O6, BaMg2Si2O7. The resistance value of the thermal resistor is approx. 6mum thick using an Au conductive paste through application and sintering process. Next, a thick film glass layer 4 is formed into a thermal head. The enameled substrate 1 is used as an insulation substrate and a radiation substrate of a thermal head, thus radially dissipating an accumulated energy of the thermal head to the outside of the system effectively as radiation energy. Consequently a low cost thermal head which enables high-quality printing can be obtained. |
