| 摘要 |
PURPOSE:To enable the protection of an integrated circuit and the maintenance of the quality thereof at a prescribed level, by filling up a high-temperature solder in a concavity of a ceramic package so as to join the opening edge of a cap to the ceramic pakage, and by sealing airtightly the integrated circuit by means of the cap and the ceramic package. CONSTITUTION:An integrated circuit 2 is bonded on a mounting member 1a of a ceramic package 1, and a terminal 2a of the integrated circuit 2 is connected to a connection terminal 1b of the ceramic package 1. A cap 4 covers the integrated circuit 4, the opening edge 2b thereof is fitted in a concavity 3 of the ceramic package 1, and an opening of the cap 4 is covered with the ceramic package 1, while the cap 4 is bonded on the back of the integrated circuit 2. A high-temperature solder 5 in the shape of a sheet is supplied into the concavity 3 of the ceramic package 1. By making the solder reflow, the cap 4 is bonded to the ceramic package 1, and the integrated circuit 2 is sealed airtightly by the cap 4 and the ceramic package 1. By this construction, the integrated circuit can be protected, and the quality thereof can be maintained at a prescribed level. |
