| 摘要 |
PURPOSE:To provide the titled compsn. having excellent moldability, heat resistance, etc., by blending a thermoplastic resin contg. an imide copolymer mainly composed of an arom. vinyl monomer and an unsaturated dicarboxylic acid imide derivative with a thermally conductive filler. CONSTITUTION:An arom. vinyl compd. (e.g., styrene) is copolymerized with an unsaturated dicarboxylic acid anhydride (e.g., maleic anhydride), a copolymerizable vinyl monomer, etc. in the presence of a rubbery polymer (e.g., polybutadiene) and the resulting copolymer is imidated to produce an imide copolymer composed of 0-40wt% rubbery polymer, 30-90wt% residue of an arom. vinyl monomer, 3-70wt% residue of an unsaturated dicarboxylic acid imide derivative and 0-40wt% residue of other vinyl monomer. 10-50wt% thermoplastic resin contg. at least 10wt% said copolymer is mixed with 90-50wt% thermally conductive filler (e.g., alumina) to obtain a heat-dissipating resin compsn.
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