发明名称 FORMATION OF CONDUCTIVE ADHESION COUPLING
摘要 A method of manufacturing an electrically conductive adhesive bond between electrically conductive parts whose surfaces to be bonded exhibit a certain surface roughness, the surfaces to be bonded each being provided with a layer of at least one transition element of the first and/or second transition series of the periodic system of elements, which layer has a surface roughness in the mu m-range, such a quantity of an electrically non-conductive adhesive being used to form the adhesive bond that the raised portions of the transition-element-layer are still in contact with each other.
申请公布号 JPS62213077(A) 申请公布日期 1987.09.18
申请号 JP19870052220 申请日期 1987.03.09
申请人 PHILIPS GLOEILAMPENFAB:NV 发明人 HARUTOMAN HIIBERU;BUORUFUGANGU TEUSU
分类号 H01L21/60;H01R4/04;H01R43/00;H05K3/32;H05K3/40 主分类号 H01L21/60
代理机构 代理人
主权项
地址