发明名称 |
FORMATION OF CONDUCTIVE ADHESION COUPLING |
摘要 |
A method of manufacturing an electrically conductive adhesive bond between electrically conductive parts whose surfaces to be bonded exhibit a certain surface roughness, the surfaces to be bonded each being provided with a layer of at least one transition element of the first and/or second transition series of the periodic system of elements, which layer has a surface roughness in the mu m-range, such a quantity of an electrically non-conductive adhesive being used to form the adhesive bond that the raised portions of the transition-element-layer are still in contact with each other. |
申请公布号 |
JPS62213077(A) |
申请公布日期 |
1987.09.18 |
申请号 |
JP19870052220 |
申请日期 |
1987.03.09 |
申请人 |
PHILIPS GLOEILAMPENFAB:NV |
发明人 |
HARUTOMAN HIIBERU;BUORUFUGANGU TEUSU |
分类号 |
H01L21/60;H01R4/04;H01R43/00;H05K3/32;H05K3/40 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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