发明名称 PHOTOSENSITIVE RESIN COMPOSITION
摘要 A photosensitive resin composition comprising (a) 10 to 90 parts by weight of at least one polymerizable monomer of the formula: <IMAGE> (R is defined in the specification), (b) 90 to 10 parts by weight of at least one compound selected from the group consisting of epoxy-acrylate resins, 1,2-polybutadiene resins, polyester resins and organopolysiloxanes, all having one or more acryloyloxy or methacryloyloxy groups in their molecular end or ends, and (c) 0.05 to 5 parts by weight of a photosensitizer based on 100 parts by weight of the sum of the components (a) and (b) shows slight shrinkage and the resulting coating film is good in adhesive properties and mechanical strength.
申请公布号 DE3373024(D1) 申请公布日期 1987.09.17
申请号 DE19833373024 申请日期 1983.05.24
申请人 HITACHI, LTD. 发明人 AZUMA, KAZUFUMI;NATE, KAZUO;NAKATANI, MITSUO;YOKONO, HITOSHI;ENDO, TAKESHI
分类号 C08F24/00;C08F2/50;C08F290/00;C08F299/00;C08F299/02;C08G65/00;C08G67/00;C09D4/00;C09D5/00;G03F7/027;(IPC1-7):G03C1/68;C08F291/00 主分类号 C08F24/00
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