| 摘要 |
PURPOSE:To improve the thermal response of a hybrid integrated circuit device through increasing of the quantity of heat to be transmitted to a temperature detection element by forming plural electric conductors, in a comb-like form, which thermally contacts a hybrid integrated circuit substrate, on a wiring board, arranging the electric conductors in a configuration in which the comb-like forms are mutually opposed, and electrically connecting at least one of the electric conductors to the temperature detection element. CONSTITUTION:The first electric conductors 16a, 16b and the second electric conductor 17a, 17b are formed in a comb-like form respectively in a region shown by 16' and 17', and arranged in a mutually opposite position on the lower surface of a flexible cable plate 11. A thermally contacting area between the electric conductors becomes large and a thermal resistance becomes low. The electric conductors exposed 16a, 16b, 17a, 17b are pressed against or soldered to an object such as the temperature of a hybrid integrated circuit substrate which temperature should be detected. Consequently the quantity of heat to be transmitted from the hybrid integrated circuit substrate which temperature should be detected to the temperature detection element is increased and the area of the electric conductor which thermally contacts the hybrid integrated circuit board is significantly increased. |
