发明名称 |
Method for producing miniaturised connections (microconnections) by means of solid-state welding |
摘要 |
<p>A method for producing miniaturised connections in electronic circuits by means of solid-state welding without any external supply of heat, current pulses being passed between a welding electrode and the materials which are to be welded, the amplitude of which current pulses is dimensioned such that the current intensity on the welding surface is 10<9> to 10<10> A/m<2>, with a pulse duration in the range from 10<-6> to 10<-3>s and a pulse interval of 0 to 10 x 10<-3>s. <IMAGE></p> |
申请公布号 |
DE3608009(A1) |
申请公布日期 |
1987.09.17 |
申请号 |
DE19863608009 |
申请日期 |
1986.03.11 |
申请人 |
PHILIPS PATENTVERWALTUNG GMBH |
发明人 |
HIEBER,HARTMANN,DR.-PHSY.;PAPE-HIEBER,KARIN,DIPL.-ING. |
分类号 |
B23K11/31;H01L21/60;H01R43/02;(IPC1-7):H01R43/02;B23K11/10 |
主分类号 |
B23K11/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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