发明名称 Method for producing miniaturised connections (microconnections) by means of solid-state welding
摘要 <p>A method for producing miniaturised connections in electronic circuits by means of solid-state welding without any external supply of heat, current pulses being passed between a welding electrode and the materials which are to be welded, the amplitude of which current pulses is dimensioned such that the current intensity on the welding surface is 10<9> to 10<10> A/m<2>, with a pulse duration in the range from 10<-6> to 10<-3>s and a pulse interval of 0 to 10 x 10<-3>s. <IMAGE></p>
申请公布号 DE3608009(A1) 申请公布日期 1987.09.17
申请号 DE19863608009 申请日期 1986.03.11
申请人 PHILIPS PATENTVERWALTUNG GMBH 发明人 HIEBER,HARTMANN,DR.-PHSY.;PAPE-HIEBER,KARIN,DIPL.-ING.
分类号 B23K11/31;H01L21/60;H01R43/02;(IPC1-7):H01R43/02;B23K11/10 主分类号 B23K11/31
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