发明名称 METHOD FOR DEPOSITION OF CONDUCTIVE THIN FILM
摘要 PURPOSE:To eliminate cracks by making an inclination angle of a deposited film at a step part gentle by subjecting the deposited conductive film to heating by irradiation with electron beam in process of deposition of the conductive film on a substrate having step parts so as to fluidize it. CONSTITUTION:In step parts on openings 6 or edges of a gate electrode 4, there are microcracks or overhangs produced because of a bad side coverage. A sample is moved to an electron beam annealing device and a film 7a of aluminum including silicon is heated by irradiation with electron beam so that it is fused for an extremely short time as about 1 microsecond or shorter. As a result, the film changes into an aluminum film 7b including silicon with overhangs or microcracks eliminated and which has a gentle inclination.
申请公布号 JPS62211915(A) 申请公布日期 1987.09.17
申请号 JP19860055675 申请日期 1986.03.12
申请人 NEC CORP 发明人 OKABAYASHI HIDEKAZU;SAITO SHUICHI;NAGASAWA EIJI;MOGAMI TORU
分类号 H01L21/3205;H01L21/28 主分类号 H01L21/3205
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