发明名称 RESIN-SEAL MOLDING EQUIPMENT FOR SEMICONDUCTOR DEVICE
摘要 PURPOSE:To make injection speed uniform and to make the injection time for a resin and the conditions of molding constant, while to improve the quality of a resin-seal body by mounting a cylinder for tuning and supplying each injection cylinder with a hydraulic fluid in parallel. CONSTITUTION:A pressure hydraulic fluid passes through a throttle valve 21 set at proper resin injection-speed, and branched and fed to the input sides of each cylinder chamber in a tuning cylinder 22, each piston 23 is operated in the same manner, and the hydraulic fluid is injected into each injection cylinder 4 in parallel from the output sides of each piston chamber. Plungers 6 are elevated, resins for sealing in chambers 3 being inserted and fixed extending over a lower surface plate 1 and a bottom force 2 are injected to the pot 9 sides, and the resin is injected.
申请公布号 JPS6037134(A) 申请公布日期 1985.02.26
申请号 JP19830145908 申请日期 1983.08.08
申请人 MITSUBISHI DENKI KK 发明人 KOBAYASHI KUNIO;YAMADA HIROMICHI;YANAGIYA KOUJI
分类号 H01L21/56;B29C45/02;B29C45/14;B29C45/53;B29C45/82;B29L31/34 主分类号 H01L21/56
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