| 摘要 |
<p>PURPOSE:To obtain a device characterized by high moisture resisting reliability, excellent electric characteristic, high heat resisting reliability and less internal stress, by using an epoxy resin composition including a specified components. CONSTITUTION:An epoxy resin composition used for sealing is composed of the following materials: epoxy resin; phenol resin; and a remaining heterocyclic compound group, in which both ends of a molecule chain have at least two second-class amino group in a molecule. The composition is obtained by using a silica filler and the like, whose surface of a particle is covered with a coating layer. Its main part is an additive reaction product comprising the following materials: polydimethyl siloxane oligomer, in which the chain part of a molecule chain is coupled with nitrogen of the second-class amino group of any of the remaining end group; and a compound, which has at least two epoxy group in the molecule. Thus the highly reliable semiconductor, in which internal stress is decreased and the amount of a hardening accelerator is largely decreased or made to be zero, is obtained.</p> |
