| 摘要 |
<p>PURPOSE:To facilitate removing soot adhering to the surface of a semiconductor product after laser beam application and reducing man-hours significantly by a method wherein a brushing mechanism is constituted by a transfer part which transfers the semiconductor product and a brushing part which has a conductive brush and a housing. CONSTITUTION:Semiconductor products 3 are transferred to a brushing part by a transfer part 5 after laser beam application and a brushing part is constituted by a conductive brush 1, a housing 2, a shaft 6, a motor 7 and a duct 8. As for operation, the brush 1 and the housing 2 are connected to the motor 7 through the shaft 6 and rotated and soot on the surface of the semiconductor products transferred after laser beam application is removed by suction of the duct 8. By employing the conductive brush 1, the soot adhering to the surface of the semiconductor product after laser beam application can be removed without breaking down the semiconductor product by static electricity and, moreover, significant man-hour savings can be realized.</p> |
