发明名称 PLASMA PROCESSING METHOD AND ITS DEVICE
摘要 PURPOSE:To uniform control the distribution of a processing speed inside a sample-processed plane with good reproducibility, by getting an electric field overlapped by a correcting magnetic field in correspondence with positions where a distribution of a speed of processing a sample by an ionized gas is uneven. CONSTITUTION:In case that evenness is deteriorated, a distribution of an etching speed fluctuates in a concentric circle-shaped form with the rotational axis of a rotational magnetic field element 6 serving as a center. Then, a luminous amount of plasma is monitored by a photo-detector 11 at respective points of an etched plane of a sample 8, and a mean value of time is computed by a microcomputer, so that the scattering in the distribution of the etching speed can be detected. A magnetic density is corrected in accordance with positions, where the scattering in its distribution occurs, by electrifying a specific oil in a means 4 for generating the correcting magnetic field. Resultantly the scattering in the distribution of the etching speed can be reduced.
申请公布号 JPS62210622(A) 申请公布日期 1987.09.16
申请号 JP19860052447 申请日期 1986.03.12
申请人 HITACHI LTD 发明人 HARADA TAKESHI;OMOTO YUTAKA;KAKEHI YUTAKA
分类号 H01L21/205;H01L21/302;H01L21/3065;H01L21/31 主分类号 H01L21/205
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