| 摘要 |
A flat housing package for microcircuits constructed entirely of metal with a stainless steel, cold-rolled steel, 52 alloy, or KOVAR frame (10) and an alumina/copper alloy base (20) and the process for brazing the components to one another. The brazing process involves heating the frame (10) and (20) base in three different heating zones and permits brazing at temperatures above 800 DEG C. The package has good heat transfer characteristics and electrical connections between the microcircuit substrates and the housing can be reworked without disturbing the brazed seal between the frame and the base. |
